πŸ–₯️Industrial PC & Server
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Technology & Engineering

Industrial computers fail for predictable reasons: heat, power, vibration and aging components. Our engineering rules target each one directly.

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Wide-Temperature Engineering

Components are selected and derated for the full operating envelope. Standard units run 0–50 Β°C; industrial options extend to -40 Β°C to +85 Β°C with validated storage ranges, so cabinets, vehicles and roadside sites stay reliable in any climate.

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Power Integrity

From 9–36 V wide-voltage DC modules to 1+1 redundant hot-swap PSUs, every design protects against brownouts and surges. Watchdog timers, AT/ATX modes and remote power control keep unattended systems recoverable.

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Mechanical Ruggedness

Steel chassis with lockable doors, shock-mounted drive bays, anti-vibration HDD mounts and tool-free service access. All-I/O-on-one-side layouts and front-accessible USB simplify maintenance in tight cabinets.

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Security & Manageability

TPM 2.0 headers, drive encryption support, domestic BMC modules with IPMI/SOL/KVM-over-IP on server platforms, and trusted domestic CPU options (Hygon, Phytium) for regulated industries.

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Burn-In & Quality Control

Every unit passes incoming component inspection, assembly checks and a full burn-in cycle before shipping. Test reports, lot traceability and photos are available per order.

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OEM / ODM Flexibility

Custom I/O brackets, BIOS settings, logos, packaging, accessories and long-life supply commitments. Minimum order quantities are negotiable for qualified integrators and distributors.

Platform Coverage

One factory, three processor ecosystems β€” so you can standardize on one supplier for both commercial and domestic supply-chain projects.

Intel

Celeron J1900/J6412 Β· Atom x6425E Β· Core 6th–14th Gen Β· Xeon Scalable (Skylake-SP/Cascade Lake-SP)

Hygon

HG3250 / HG3330 / HG3350 (BGA1515) β€” domestic x86 platform

Phytium

S5000C dual 64-core ARM @ 2.1 GHz β€” domestic high-performance ARM

Testing before it leaves the factory

Each unit is submitted to a burn-in cycle at elevated temperature with a full I/O loop test β€” memory, storage, Ethernet, COM and display channels are exercised under load. Only units that pass are packed; test records accompany the shipment.